Level Package

Level Package

Surge Capacity To Promote The Transfer Of The Rapid Growth Of China Packaging Industry

Recent years, China has become an international Semiconductor Manufacturers and assembly and test foundry production capacity of hot transfer package, the cheap labor to reduce production costs. So the scale of China's semiconductor packaging industry expanded rapidly.

The growth of China's semiconductor packaging industry by two effects: on the one hand, China Chip Chip-scale manufacturing continues to expand, on the other hand, huge and rapidly growing terminal Electronic Applications. Despite China's semiconductor packaging industry Financial Impact of the crisis, but the global semiconductor market, the importance of packaging has become increasingly prominent.

The early industrial development, China's IC packaging and testing of foreign and joint venture enterprises are mainly concentrated in the package has a relatively mature product in a low pin count. However, with foreign investment and joint ventures will be advanced packaging production lines to China, to package substrate-based products appeared to grow rapidly. Ball Grid Array package Chip Level packaging, wafer level packaging and system-level packaging will become mainstream. Wafer Bumping Assembly has also begun to take shape. Perforated silicon technology has been applied in image Sensor On and has been in volume production. In support of the Government's special funds, local packaging companies are quick progress of technology.

Yangtze River Delta region IC packaging and testing industry is still the most promising areas. However, in order to reduce costs, in recent years a number of IC packaging and testing companies have chosen to create a new factory in central and western regions. Part of the integrated device manufacturers and foundry IC packaging and testing companies will shift production to central and western regions, this trend will continue for several years.

China's semiconductor packaging materials market in 2009 to more than 2.2 billion U.S. dollars, more than 1% increase in 2008. Is expected to reach 3.1 billion by 2011.

Transfer of production capacity will continue to promote the growth of China's packaging industry

2004 to 2011 compound annual growth rate (CAGR) of 20% of the main engine of growth from the substrate, high-end packaging materials still rely mainly on imports. In the lead frame section, added several high-end products for the production line etching, however, leading local enterprises and overseas enterprises in the technology gap remains huge. In recent years, begun to replace copper wire gold wire, copper wire diameter of more than 2mil used and low pin count products. More than 90% (in meters) of copper is applied to discrete devices and power devices (with lead frame as the substrate). Copper substrates used in packaging process has also been in volume production. On the packaging plant, the lower packaging material costs and improve production efficiency is the main effective way to reduce costs, especially for the packaging substrate, lead frame and bonding wire and other material parts, packaging material suppliers will face the future more than 20% price cut pressure.

Packaging equipment market in China in 2008 reached 452 million U.S. dollars. Affected by economic crisis, the Chinese packaging equipment market in 2009 is expected to decline about 34%, to 300 million U.S. dollars. With the rapid growth of packaging equipment market, some of the leading equipment manufacturers in China set up a production line. However, local packaging equipment accounted for less than 15% market share in China and is mainly used in low-end market.

Transfer of production capacity will continue to promote the growth of China's packaging industry

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